It is aimed at embedded memory, such as for cache in IoT and AI applications.
“This is currently the world’s fastest write speed for embedded memory application with a density over 100Mbit and will pave the way for the mass-production of large capacity STT-MRAM,” according to the University. “The current capacity of STT-MRAM is ranged between 8Mbit and 40Mbit.”
STT-MRAM is non-volatile – it retains data even with power removed – leading to it gaining traction as the next-generation technology for embedded memory, main memory and logic, said Tohoku. “Three large semiconductor fabrication plants have announced that risk mass-production will begin,” it said.
The team, from the Center for Innovative Integrated Electronic Systems (CIES) used magnetic tunnel junctions (MTJs) integrated with CMOS.
To reduce the memory size , the MTJs were formed directly on via holes.
In the fabricated chip, sub-array write speed was measured at 14ns at 1.2V. “To date, this is the fastest write speed operation in an STT-MRAM chip with a density over 100Mb in the world,” claimed the Center.
IEDM paper: ’14ns write speed 128Mb density embedded STT-MRAM with endurance >1010 and 10yrs retention @ 85°C using novel low damage MTJ integration process’.
Image:
Left, artists impression of 128Mbit-density STT-MRAM
Right, Shmoo plot for write speed versus supply voltage, which shows the measured bit rate at each speed and voltage.